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Famobs – Frequency agile microwave bonding system
The cost of packaging in micro electronics is around 30% of total production costs, but this is rising at due to the increasing consumer demand for smaller and smarter portable electronic devices. In micro systems, the costs of packaging can be up to 80% of total production costs. Technological advances to reduce packaging costs are therefore of pivotal importance to maintain the competitive edge of assembly companies.
Our approach of using microwave technology in bonding has significant advantages over technologies made available in the market. Famobs-system is an open ended microwave oven that enables to perform the placement, alignment and curing at the same time thus reducing production steps and time. Quality of the bonds will be improved as well due to better selectivity and special designed materials as well as the precisely adaptable frequency of the microwave. It uses pulsed microwave sources and relies on the selection of a few resonant frequencies that are jittered (mode hopping). The two characteristics permit not only the avoidance of electrical discharges through arcing, but also the accurate curing of the paste at the location of interest, for example, at the interface between a die and the substrate.
Famobs consortium consists of 12 partners from 5 different countries. Total budget of the project is 2.4 million €.
The cost of packaging in micro electronics is around 30% of total production costs, but this is rising at due to the increasing consumer demand for smaller and smarter portable electronic devices. In micro systems, the costs of packaging can be up to 80% of total production costs. Technological advances to reduce packaging costs are therefore of pivotal importance to maintain the competitive edge of assembly companies.
Our approach of using microwave technology in bonding has significant advantages over technologies made available in the market. Famobs-system is an open ended microwave oven that enables to perform the placement, alignment and curing at the same time thus reducing production steps and time. Quality of the bonds will be improved as well due to better selectivity and special designed materials as well as the precisely adaptable frequency of the microwave. It uses pulsed microwave sources and relies on the selection of a few resonant frequencies that are jittered (mode hopping). The two characteristics permit not only the avoidance of electrical discharges through arcing, but also the accurate curing of the paste at the location of interest, for example, at the interface between a die and the substrate.
Famobs consortium consists of 12 partners from 5 different countries. Total budget of the project is 2.4 million €.
Project duration: 2008-2011
Link to the project website: Famobs
Contact person: Marju Ferenets, marju.ferenets@pera.com